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Chips & Hardware · Report
TSMC's 3nm, 2nm process nodes and CoWoS advanced packaging remain supply-constrained as AWS, MediaTek, and TPU customers compete for limited allocation.
AI chip bottleneck remains at packaging rather than logic; CoWoS yield and capacity are hard limits on AI accelerator supply, keeping chiplet costs elevated and accelerating alternative-packaging investment.
Trade pressSlicast · September 15, 2026 at 03:30 UTC · US · Source: digitimes
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