반도체·하드웨어 · 리포트
TSMC's 3nm, 2nm process nodes and CoWoS advanced packaging remain supply-constrained as AWS, MediaTek, and TPU customers compete for limited allocation.
AI chip bottleneck remains at packaging rather than logic; CoWoS yield and capacity are hard limits on AI accelerator supply, keeping chiplet costs elevated and accelerating alternative-packaging investment.
업계 전문지Slicast · 2026년 9월 15일 03:30 UTC · 미국 · 출처: digitimes
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