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ASE's SPIL advanced-packaging subsidiary reportedly nears Arizona expansion as TSMC CoWoS and Amkor accelerate US advanced packaging deployment.

Onshored CoWoS-equivalent capacity advances; validates HBM/GPU interconnect onshore packaging consolidation; eases supply-chain concentration risk.
통신사Slicast · 2026년 9월 15일 04:09 UTC · 미국 · 출처: TrendForce
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ASE's SPIL advanced-packaging subsidiary… · Slicast