GlobalFoundries reaches agreement with TSMC to establish U.S.-based supply of silicon interposers for advanced AI chip packaging as part of a $2 billion deal.

GlobalFoundries announced a multi-year $2 billion manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC and add fabrication capacity at its Malta, New York facility to support growing demand for high-performance computing and AI systems, with the agreement providing a foundation to expand capacity over time as customer demand grows.

GF expects to expand capacity at Malta and establish the first U.S.-based source of silicon interposers supporting advanced packaging technologies, including embedded deep trench capacitor components. The additional manufacturing capacity will provide greater scale and flexibility for delivering advanced packaging solutions across multiple product generations.

"Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems," said Ed Kaste, senior vice president of CMOS Business at GF. "By providing manufacturing service using GF's trusted U.S. manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain."

Volume production is expected to begin ramping at GF's Malta site during the first half of 2028. The agreement has an initial term of five years and provides a framework for future capacity expansion.