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TSMC affiliate GUC posted record revenue as turnkey AI chip packaging and assembly surpassed 80% of its business.
The shift to turnkey chiplet-integration services reflects hyperscaler preference for modular, proprietary packaging over monolithic Nvidia designs; TSMC CoWoS capacity now defines AI chip deployment speed.
Trade pressSlicast · August 5, 2026 at 12:54 UTC · US · Source: Tech Times
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