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TSMC's CoWoS AI chip packaging capacity at maximum; outsourcing additional Nvidia GPU volume to Japan, Samsung, and Intel-subsidiaries as demand overwhelms production.

Supply chain bottleneck: Nvidia GPU delivery constrained by packaging capacity despite outsourcing; chip scarcity persists.
Trade pressSlicast · August 5, 2026 · China · Source: 36氪
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TSMC's CoWoS AI chip packaging capacity at maximum; outsourcing additional Nvidia GPU volume to Japan, Samsung, and Intel-subsidiaries as demand overwhelms production.

Supply chain bottleneck: Nvidia GPU delivery constrained by packaging capacity despite outsourcing; chip scarcity persists.

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TSMC's CoWoS AI chip packaging capacity at… · Slicast