Broadcom-Toppan joint venture opens its first substrate manufacturing plant in Singapore, targeting advanced AI chip packaging demand.

Advanced Substrate Technologies (AST), a joint venture between US chipmaker Broadcom and Japan's Toppan Holdings, has opened a substrate manufacturing plant in Singapore. The company says the facility is the first in the country capable of producing high-end flip chip ball grid array (FC-BGA) substrates, which serve advanced semiconductor products across artificial intelligence, networking, and high-performance computing applications.

Located in the Jurong Lake District, the plant spans approximately 95,000 square meters and will produce large-body, high-layer-count FC-BGA substrates for AI compute, networking, and high-performance computing devices. The facility incorporates solar panels and water recycling systems, and houses research and development facilities linked with local technology institutions.

For Toppan, the plant marks its first manufacturing facility of this kind outside Japan, operating alongside the group's main production hub in Niigata. The Singapore facility was backed by Singapore's Economic Development Board and JTC Corporation, the government's lead statutory board under the Ministry of Trade and Industry.

The project addresses a critical supply constraint in the semiconductor industry. According to AST, "demand for advanced substrate capacity, a persistent bottleneck for AI, networking, and next-generation computing chips, continues to outpace global supply." AST plans to begin high-value manufacturing by late 2026 and will work with Toppan and Broadcom to increase output as demand grows.

AST CEO Yoshiyuki Iida commented: "AST's ability to deliver large-body, high-layer-count substrates at Toppan's exacting standard is helping meet a real bottleneck in AI and networking chip production. We are grateful for the longstanding support and partnership of the Singapore government in this venture. This investment reflects both Toppan and Broadcom's long-term commitment to Singapore as a critical hub in our global manufacturing network and strengthens the resilience of the semiconductor supply chain."