GlobalFoundries signs a $2 billion, five-year deal with TSMC to produce advanced-packaging silicon interposers at its Malta, New York, fab.

GlobalFoundries has signed a $2 billion manufacturing agreement with TSMC to supply silicon interposers for TSMC's CoWoS advanced packaging ecosystem in the United States.

Under the agreement, GF will provide manufacturing services to TSMC and expand capacity at its fab in Malta, New York, establishing the site as the first US-based production facility for silicon interposers—thin silicon components containing through-silicon vias (TSVs) that enable 3D stacking on silicon wafers. The deal has an initial five-year term and includes provisions for future capacity expansion. Volume production is expected to ramp at the Malta facility during the first half of 2028.

"Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems," said Ed Kaste, senior vice president of CMOS business at GF. "By providing manufacturing services using GF's trusted US manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain."