TSMC awards GlobalFoundries a $2 billion contract to supply advanced packaging materials and silicon interposers in the United States.

Shares of GlobalFoundries Inc (NASDAQ:GFS) jumped 4% in premarket trading Thursday following the announcement of a $2 billion multi-year supply agreement with Taiwan Semiconductor Manufacturing Co (NYSE:TSM) to manufacture silicon interposers in the United States.

Under the agreement, GlobalFoundries will provide manufacturing services from its Malta, New York facility to support TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging ecosystem. The partnership features an initial five-year term with a framework to expand production capacity over time as customer demand increases. GlobalFoundries will add fabrication capacity to scale advanced packaging solutions across multiple product generations while integrating embedded deep trench capacitor components.

The move addresses a critical bottleneck in the semiconductor supply chain, as high-performance computing and AI hardware increasingly rely on sophisticated packaging techniques to link memory and logic chips. Volume production at the Malta facility is expected to begin ramping during the first half of 2028.

For GlobalFoundries, the partnership validates its footprint in trusted U.S. manufacturing and positions the company as an indispensable partner to the world's leading chipmaker. The collaboration signals growing alignment among top semiconductor manufacturers to establish resilient, onshore supply hubs for critical AI components.