Intel and Applied Materials are collaborating on 3D chip stacking techniques for AI accelerators, with work underway at EPIC Center.

Applied Materials and Intel are collaborating to accelerate development of chipmaking innovations essential to AI computing. The partnership brings together cutting-edge capabilities from Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Hillsboro, Oregon, with the goal of shortening the time-to-market for advanced semiconductor technologies.

The collaboration spans next-generation transistors, interconnects, and advanced packaging technologies. Teams from both companies are working on materials, process technologies, and device architectures for advanced logic nodes targeting AI workloads, with focus on both front-end and back-end-of-line advancements, including interconnect scaling. The work also encompasses development of advanced packaging technologies for Foveros-based 3D stacking, which supports higher interconnect density, improved power delivery, and enhanced thermal performance for high-performance compute platforms designed to accelerate emerging agentic AI workloads.

"Applied and Intel share a decades-long history of deep collaboration focused on pushing the boundaries of materials engineering to advance the semiconductor roadmap," said Gary Dickerson, President and CEO of Applied Materials. "Bringing our teams together at the EPIC Center will deepen that partnership and accelerate the transistor, interconnect and packaging innovations needed to drive the future of AI computing."

Lip-Bu Tan, CEO of Intel, noted: "The demand for AI computing is driving the need for major advances in performance, power efficiency, and packaging. Intel is focused on delivering those innovations and doing it in close collaboration with partners across the ecosystem. Applied Materials is an important partner, and we look forward to expanding our work together at the EPIC Center to help accelerate the path from the lab to high-volume manufacturing in the United States."

Applied's new EPIC (Equipment and Process Innovation and Commercialization) Center is scheduled to be operationally ready this year and is designed to dramatically reduce the time required to commercialize breakthrough technologies from early-stage research to full-scale manufacturing. For chipmakers, the facility will provide earlier access to Applied's R&D portfolio, faster cycles of learning, and accelerated transfer of next-generation technologies into high-volume manufacturing within a secure collaborative environment. Intel is participating as a founding partner at the center.