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TSMC revives Longtan production hub for 1.4-nanometer process node and CoWoS advanced packaging, both globally sold out.
Confirms TSMC at maximum utilization across leading-edge nodes; CoWoS shortage constrains Nvidia/AMD GPU packaging; validates foundry as critical chokepoint.
Trade pressSlicast · August 9, 2026 at 10:59 UTC · US · Source: Tech Times
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