Samsung과 Broadcom이 공동 AI 반도체 개발 및 공급을 위한 $200 billion 규모의 양해각서를 발표했습니다.

Samsung Electronics and Broadcom have signed a Memorandum of Understanding to deepen their collaboration on next-generation semiconductor technologies. The agreement, signed at the AI Summit in San Francisco, is expected to be worth over $200 billion across memory and foundry technologies through 2030.

Under the partnership, Samsung will supply Broadcom with advanced memory products, including High Bandwidth Memory (HBM), a critical component for powering increasingly complex AI systems. The companies will also collaborate on Samsung's cutting-edge 2-nanometre manufacturing process and advanced chip packaging technologies designed to deliver faster, more power-efficient AI and networking chips.

Beyond memory, Samsung will manufacture Broadcom's Wireless Broadband Communications (WBC) solutions using its latest semiconductor processes. The partnership will also focus on developing advanced 2.3D and 2.5D packaging technologies that combine multiple chips into a single high-performance package, improving both speed and energy efficiency.

The move reflects mounting pressures on chipmakers to deliver more powerful hardware as AI adoption accelerates across industries. Samsung Electronics Vice Chairman and CEO of the Device Solutions Division, Young Hyun Jun, stated: "AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging. By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future."

Broadcom President of Semiconductor Solutions Group, Charlie Kawwas, added: "As AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important. By combining Samsung's memory and foundry expertise with Broadcom's AI and connectivity leadership, we aim to continue to deliver technologies that power the next generation of AI infrastructure."