반도체·하드웨어 · 리포트
Intel and SK Hynix are exploring joint or parallel DRAM production facilities in the United States to secure memory supply for AI workloads.
Addresses the looming HBM and high-bandwidth memory bottleneck by localizing advanced packaging and fabrication, reducing geopolitical supply chain risk.
업계 전문지Slicast · 2026년 9월 16일 12:59 UTC · 미국 · 출처: TechPowerUp
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