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Intel and SK Hynix are exploring joint or parallel DRAM production facilities in the United States to secure memory supply for AI workloads.
Addresses the looming HBM and high-bandwidth memory bottleneck by localizing advanced packaging and fabrication, reducing geopolitical supply chain risk.
Trade pressSlicast · September 16, 2026 at 12:59 UTC · US · Source: TechPowerUp
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