Intel accelerates Ohio fab construction schedule to expand EMIB-T advanced packaging production capacity.

Intel is accelerating construction of its large chip factory in Ohio, United States, as it advances plans to produce advanced chips. To expedite completion, the company has begun offering workers generous overtime bonuses.

The facility spans more than 400 hectares and will be central to Intel's "Angstrom" era roadmap. It is being built to support mass production using the company's 18A and 14A process technologies, with Intel targeting production readiness for next-generation advanced chips by 2031.

In parallel, Intel is making significant progress with its advanced chip packaging technology, EMIB-T (Embedded Multi-die Interconnect Bridge with Through-Silicon Vias). The company reports production yields now approaching 90%, positioning EMIB-T as a strong competitor to TSMC's CoWoS-L packaging technology.

EMIB-T uses vertical connections built directly into embedded silicon bridges within an organic substrate, enabling three-dimensional chiplet stacking without requiring a full silicon interposer—a far more expensive component. Intel states this approach reduces costs by approximately 50% compared to equivalent TSMC solutions. The company plans to leverage this cost advantage by expanding its new Ohio facilities.

Intel expects to launch large-scale EMIB-T packaging services in 2027, targeting processor and AI accelerator manufacturers seeking to reduce costs while maintaining performance levels.

One persistent challenge remains: manufacturing yields for organic substrates supplied by partners including Ibiden, Shinko, Unimicron, and AT&S remain around 50%. Despite this hurdle, Intel's suppliers are actively working to improve yields and meet anticipated demand.