MediaTek advances 400G SerDes on 2nm process, targeting Google TPU v10 and Meta custom AI ASICs.

MediaTek's ambitions in AI ASICs extend well beyond its current success with Google's TPU v9. According to Commercial Times, MediaTek's 400G/448G SerDes IP, expected to be ready in the second half of 2027, positions the company to bid on next-generation AI ASIC programs, including Google's TPU v10 and Meta's custom AI chips.

MediaTek has already captured a significant share of Google's TPU v9 orders by leveraging its 336G SerDes IP, with mass production targeted for early 2028. As Google's TPU v10 upgrades to 400G/448G SerDes, successful IP validation could enable MediaTek to compete directly with Broadcom for future TPU business. GF Securities analyst Jeff Pu noted that MediaTek's Icefish platform is currently the only officially confirmed TPU v10 project.

The 400G SerDes IP is being developed on TSMC's 2nm process, a move that extends MediaTek's advanced-node capabilities into data center AI ASICs and reinforces its expanding footprint in AI chip design.

At its recent earnings call, MediaTek outlined a two-generation AI ASIC roadmap, widely believed to correspond to Google's TPU v8 and v9 programs. The company's first-generation AI accelerator ASIC is scheduled for mass production in Q4, while the second-generation processor is progressing on track for early 2028. CEO Rick Tsai emphasized this momentum by raising MediaTek's 2027 AI ASIC market share target to 15–20%, up from the previous 10–15%.

Meta's parallel infrastructure expansion is creating additional opportunities. Its Prometheus AI supercluster is designed to exceed 1GW of compute capacity, with the long-term Hyperion target reaching 5GW—significantly larger than current interconnect capabilities, which deliver roughly 102.4T–115.2T of bandwidth per compute unit when using a 600mm rack backplane with 200G SerDes.

To address these interconnect constraints, Meta has been co-developing multiple generations of custom MTIA AI chips with Broadcom. Industry analysts suggest that Meta's multi-vendor ASIC strategy creates an opening for MediaTek; if the company successfully completes its 400G SerDes IP and combines it with CPC, CPO, and advanced packaging technologies, it could compete for new design wins after 2027.

MediaTek's partnership with Google also extends to manufacturing. CEO Rick Tsai confirmed on Friday's earnings call that MediaTek is using Intel's EMIB-T advanced packaging technology for its AI ASIC program—marking the first public acknowledgment of this collaboration. This move reflects growing TPU demand: analyst reports indicate Google plans to order 12–15 million TPU v9 processors in 2028, a volume that could rival or exceed NVIDIA's AI GPU shipments.

Meeting such demand may require additional manufacturing capacity beyond TSMC, positioning Intel Foundry's EMIB technology as a strategic enabler. Intel previously secured orders for approximately 3 million TPUs after Google validated its advanced packaging capabilities.