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SK Hynix encounters technical difficulties in HBM hybrid bonding processes, falling behind Samsung's progress.

Delays in HBM capacity from a major supplier could constrain GPU memory stacks and AI accelerator performance in 2026.
Trade pressSlicast · October 7, 2026 at 12:31 UTC · US · Source: TechPowerUp
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SK Hynix
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CommentaryCXMT vs SK Hynix vs Samsung: AI Memory Supply, HBM Pricing Power, and the China GapCommentarySK Hynix HBM Lock-In, Solidigm IPO, and US Fab Bet, September 2026
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SK Hynix encounters technical difficulties in… · Slicast