Anthropic exploring Samsung Electronics' 2nm process node for fabrication of custom AI accelerators.

Samsung and Anthropic have been discussing a potential AI chip manufacturing contract, with earlier reports indicating that Anthropic could leverage Samsung's cutting-edge 2nm process to produce custom AI chips. Recent developments suggest the project is progressing, with new details emerging about Anthropic's plans.

In August 2026, Anthropic confirmed the launch of a custom silicon team tasked with developing proprietary AI chips. The team is building Application-Specific Integrated Circuits (ASICs) designed to support Claude AI models and handle massive AI workloads.

According to details shared by an industry expert, Anthropic has already begun its ASIC development and plans to manufacture the chips using Samsung's 2nm process. This approach could reduce development costs, accelerate time-to-production, and allow Anthropic to sidestep competition with other major AI chip makers for TSMC manufacturing capacity.

Broadcom is identified as the ASIC design vendor partnering with Anthropic on the custom chips. The design incorporates 192GB of HBM3E memory, with a potential upgrade to 288GB should PCIe Gen7 switches become available. Each accelerator will support either 8 or 16 PCIe lanes, with Anthropic prioritizing PCIe Gen7 adoption if Broadcom can integrate it faster. The target specifications call for approximately 4,000 TOPS of performance while operating at roughly 1,300W power consumption.

Anthropic is planning an initial production run of around 200,000 chips. Samsung and Anthropic have not yet officially confirmed the manufacturing agreement.

Should the deal materialize, it would provide Samsung with an additional customer for its advanced 2nm process and could strengthen the company's foundry business amid its recovery efforts.