Qualcomm Technologies announced a multi-generation collaboration with Amazon to enable customized silicon at scale for AI inference and 1.6T connectivity.
SAN DIEGO, Sept. 8, 2026 — Qualcomm Technologies, Inc. today announced a multi-generation collaboration with Amazon to deliver customized silicon at scale for large-scale AI data centers, with a primary focus on AI inference. The partnership also encompasses optical connectivity solutions supporting speeds up to 1.6T, alongside development of future-generation architectures.
Exponentially growing AI workloads are driving unprecedented demand for compute, storage, networking, memory bandwidth, and energy-efficient infrastructure. This collaboration unites Amazon’s comprehensive, secure, and price-performant AI infrastructure with Qualcomm Technologies’ expertise in power-efficient processing, silicon design, and system-level integration.
To address scaling and bandwidth requirements, the companies will jointly develop high-performance optical connectivity solutions leveraging Qualcomm’s advanced SerDes and optical digital signal processing (DSP) technologies.
Additionally, Qualcomm Technologies will expand its utilization of AWS AI infrastructure, including Amazon Bedrock, to accelerate electronic design automation (EDA) workloads and reduce chip design cycles.
“As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with increased efficiency,” said Cristiano Amon, President and CEO of Qualcomm Incorporated. “Qualcomm is pleased to partner with AWS on customized silicon and connectivity solutions, applying decades of leadership in advanced processing and power-efficient compute to deliver breakthrough performance and enable the next generation of AI infrastructure.”
“This collaboration with Qualcomm Technologies builds on a strong foundation of partnership and reflects our shared commitment to pushing the boundaries of what’s possible,” said Prasad Kalyanaraman, Vice President at AWS. “By working together on customized silicon and advanced connectivity, we are delivering more performant, efficient, and cost-effective infrastructure for our customers.”
About Qualcomm
Qualcomm (NASDAQ: QCOM) is a global computing leader at the center of the AI era, enabling intelligence to scale from the most personal devices to large‑scale infrastructure. Building on more than four decades of innovation, we develop platforms and solutions that bring together advanced AI, high‑performance, low-power computing and industry‑leading connectivity—powering products and services used around the world. At Qualcomm, we are engineering human progress.
Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering and research and development functions and substantially all of our products and services businesses, including our QCT semiconductor business. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patents are licensed by Qualcomm Incorporated. Qualcomm, Snapdragon, Qualcomm Dragonwing and Qualcomm Dragonfly are trademarks or registered trademarks of Qualcomm Incorporated.
Source: Qualcomm
The post Qualcomm and AWS Collaborate on AI Inference Chips and 1.6T Connectivity appeared first on HPCwire .