반도체·하드웨어 · 리포트
ASML's order book runs to 2030, but delivery capacity rather than demand is the bottleneck.
A multi-year backlog into 2030 means tool delivery capacity, not orders, will gate advanced-node and packaging expansion for AI chips.
업계 전문지Slicast · 2026년 11월 8일 05:21 UTC · 미국 · 출처: ad-hoc-news.de
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