Home › Chips & Hardware › ReportChips & Hardware · ReportAmazon Fuels AI Debt Boom With Bond Sale of at Least $25 BillionNewswireSlicast · July 16, 2026 at 21:04 UTC · Global · Source: Bloombergimportance 83Read the originalShareCompanies in this storyAWS / AmazonCapex history →Related reportsChips & HardwareMeta announced custom AI chip manufacturing starting September as part of a plan to scale total computing to 14 GW capacity.2026-07-17Chips & HardwareBroadcom reported $30 billion in AI bookings against $10.8 billion in shipped revenue, reflecting a massive order backlog in custom networking silicon.2026-07-17Chips & HardwareASML raised full-year sales outlook to €43–45 billion as demand for chip-making equipment accelerates due to AI boom.2026-07-17Chips & HardwareHuawei is reportedly developing DRAM manufacturing capability to reduce dependence on foreign semiconductor imports.2026-07-17Chips & HardwareTower Semiconductor announced a $3 billion expansion in Japan for 300mm silicon photonics and advanced packaging, targeting $3.6B revenue by 2028.2026-07-17