Kioxia and SanDisk's BiCS NAND flash memory packages were displayed at FMS 2026 in microscopic detail for industry analysis.

BiCS NAND is a joint endeavor by Kioxia and SanDisk. At FMS 2026, both companies displayed their NAND packages under microscopes, and we photographed the demonstrations.

Kioxia showcased its BiCS FLASH Generation 10 1Tb TLC NAND, featuring CBA technology and 332 layers. The display included a wafer sample and a die cross-section under magnification. The cross-sectional view reveals the architecture's complexity: the layers appear vertical but are actually offset—visible especially on the left side of the sample. Package balls at the top provide scale reference.

SanDisk presented its BiCS FLASH Generation 8 under magnification, with a wafer sample on display. The magnified images reveal the microscopic wires connecting the different layers—impossibly fine details invisible in standard inspection. Another view shows the package and cell structure as it would appear in production.

NAND remains a critical topic as AI-driven demand for storage reaches unprecedented levels. The engineering required to fit higher capacities and speeds into existing packages is more challenging than most users realize. These show-floor demonstrations—opened NAND packages under microscope—offer insight into that complexity. While microscopy displays of NAND have appeared at industry shows before, these particular views showcase the remarkable sophistication required to advance NAND technology forward.