TSMC의 반도체 장비 수요가 8개월 만에 거의 두 배로 증가하며, 지속적인 장비 부족 속에서 2026년 자본 지출 예산은 640억 달러에 가까워지고 있다.

Being the world’s largest contract chipmaker grants TSMC significant leverage in supplier negotiations, as it purchases far more equipment than any other foundry. However, this scale also creates unique operational challenges. When requirements grow dramatically—particularly when they nearly double in less than a year—sourcing becomes exceedingly difficult. Since the end of last year, TSMC has nearly doubled its projected semiconductor production equipment needs to expand manufacturing capacity amid surging artificial intelligence demand, according to Cliff Hou, TSMC’s deputy co-chief operating officer, who made the remarks during a fireside chat at Semicon Taiwan, as reported by FocusTaiwan. The company acknowledges it cannot fulfill every customer’s demand but is actively working to close the gap, Bloomberg noted.

TSMC typically projects its annual equipment procurement volume and associated spending. Following its initial assessment late last year, the company found that by the end of the first quarter, requirements had already reached 1.5 times the original forecast. By July, that figure climbed to 1.9 times the baseline estimate, meaning equipment needs almost doubled within roughly six months.

TSMC attributes this surge to the construction of new fabrication plants in Taiwan and the United States, alongside modernization efforts at existing facilities, which also require fresh machinery. Notably, the jump in tool quantity does not translate proportionally to cost. While TSMC significantly raised its 2026 capital expenditure budget over the past eight months, the increase falls well short of 90%. In January, the company guided 2026 CapEx between $52 billion and $56 billion. By April, it shifted toward the upper bound of that range. In July, it officially revised the forecast to $60 billion–$64 billion, representing approximately a 15% increase based on midpoint calculations.

The exact methodology TSMC uses to forecast annual tool requirements remains unclear. More pressing for the broader industry is how the foundry plans to secure this equipment given widespread wafer fab tool shortages driven by unprecedented demand across the semiconductor sector. Recent developments underscore the scale of TSMC’s expansion: the company has committed an additional $100 billion to Arizona for at least four more 2-nanometer fabs, while reports suggest potential price increases of up to 25% on chip production services in 2027. As TSMC navigates multi-fab N2 ramps, scales CoWoS and SoIC packaging, and works to uncork critical bottlenecks, securing equipment will remain a defining challenge for its growth trajectory.