Nvidia는 2028년까지 기판, 공동 패키징 광학(co-packaged optics), 첨단 패키징 및 칩 테스트 역량 확충에 수십억 달러를 투입하며, AI 가속기 공급망의 거의 모든 단계에서 생산 능력을 선점하고 있다.

On October 21, during GTC Berlin, Nvidia announced several multi-billion-dollar deals with supply chain partners across substrates, advanced packaging, semiconductor testing, and optical engines to expand production capacity. Aimed at overcoming severe bottlenecks that constrain current and future AI infrastructure buildouts, the deals include commitments and production roadmaps stretching through 2028. They secure capacity for Nvidia and build resiliency and redundancy into its AI accelerator supply chain.

"We are in the midst of the largest infrastructure buildout in human history. Demand is extraordinary. Capacity is the constraint," said Nvidia CEO Jensen Huang. "Our supply chain partners are the world's best manufacturers. I'm grateful they are expanding capacity around the globe to scale production and help us deliver the AI supercomputing systems powering this new industrial revolution."

The deals cover two major AI accelerator supply chain categories: hardware interconnects and OSAT (Outsourced Semiconductor Assembly and Test). Under hardware interconnects, Nvidia is securing capacity for both substrates and co-packaged optics. The company has signed deals with Ibiden, Unimicron, and Samsung Electro-Mechanics, three of the world's five largest substrate manufacturers, to support its capacity expansion and reserve significant portions of that capacity for the chipmaker. Nvidia says it plans to secure 2.5x dedicated substrate capacity over the next three years.

Nvidia has also signed agreements with SPIL (Siliconware Precision Industries Co., Ltd.) to expand manufacturing capacity for the optical engines used in co-packaged optics by 15x by mid-2027.