반도체·하드웨어 · 리포트
Applied Materials and Besi announce expanded strategic partnership to advance next-generation advanced packaging for AI chip scaling.
Equipment and materials vendors aligning to scale packaging capacity (chiplets, chiplet interconnect, HBM integration) required for multi-die AI accelerators.
통신사Slicast · 2026년 10월 1일 13:00 UTC · 미국 · 출처: GlobeNewswire
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