Samsung and Broadcom announce $200+ billion partnership through 2030 spanning memory, foundry, and packaging; includes major AI chip supply commitment.

Samsung Electronics has secured a landmark partnership with Broadcom valued at more than $200 billion through 2030 to manufacture and supply next-generation AI chips. Announced during a high-profile AI summit in San Francisco attended by South Korean government representatives and industry executives, the five-year strategic memorandum of understanding deepens cooperation across contract chipmaking, memory supply, and advanced packaging solutions.

Under the agreement, Samsung will utilize its sub-2nm foundry process to produce Broadcom's upcoming application-specific integrated circuits (ASICs) and Wireless Broadband Communications hardware. The partnership is strategically timed as hyperscale tech companies shift away from relying solely on general-purpose GPUs in favor of tailored AI accelerators, making Broadcom's expertise in specialized networking chips especially critical for future data center infrastructure.

To complement logic production, Samsung will supply its high-bandwidth memory (HBM) products directly to Broadcom, which will integrate them into its next-generation AI accelerators. The deal also extends to advanced 2.3D and 2.5D packaging integration, allowing both companies to combine memory, logic, and high-speed communications chips into single, highly energy-efficient modules optimized for intensive high-performance computing workloads.

The multi-year commitment delivers a substantial operational boost to Samsung's contract chipmaking division, helping narrow the market share gap with industry leader TSMC. Winning long-term production orders from a top-tier designer like Broadcom ensures high utilization rates across Samsung's advanced manufacturing facilities, further reinforcing the company's position in the competitive custom silicon space.

The deal highlights Samsung's broader effort to capitalize on global demand for AI hardware, following a $16.5 billion contract to manufacture logic chips for Tesla and ongoing talks with Nvidia about future HBM4E and HBM5 memory. By combining foundry capabilities with memory production under one roof, Samsung offers a complete end-to-end supply chain solution as South Korea works to double its national memory capacity and expand its global semiconductor footprint.