VeriMe가 지연 시간과 전력 소비 감소를 목표로 하는 3D compute-in-memory AI 칩 개발을 위해 $150M Series C를 조달했다.

Chip startup VeriMe has raised 1 billion yuan (approximately $150 million) in a Series C funding round led by a consortium of financial and strategic investors. The round includes backing from Advantage Capital, Yuanhao Investment, Jinpu Investment, Sunshine Life, Yuanhe Puhua, Delian Capital, Kuanqiao Hengsong, and Houxue Capital, alongside strategic investors MEIG Smart Technology, Hengxu Capital, and Huaqin Technology. Several existing shareholders also increased their positions in this round.

VeriMe has developed a proprietary three-dimensional compute-in-memory architecture, which the company brands as 3D-CIM. The company claims this design overcomes the "impossible triangle" that has historically constrained AI chip development—the conflicting demands for high performance, low power consumption, and low cost.

The startup's chips are designed for large-model inference across a broad range of applications, including AI phones, AI PCs, IoT devices, all-in-one machines, servers, and robots. The influx of strategic backing from hardware manufacturers reflects the timing of this moment in the market. As generative AI deployment shifts from data center workloads to consumer and edge devices, demand for inference silicon is accelerating rapidly, driven by acute pressures on power consumption and cost in these environments.

This funding round places VeriMe among the better-capitalized bets on compute-in-memory as a pathway to more efficient and cost-effective AI inference. The round ranks in the top tier of Series C financings in this sector and market segment, positioning it at approximately the 93rd percentile among comparable Series C deals.