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SK Hynix scheduled late-August groundbreaking for a $3.9 billion advanced chip packaging plant in Indiana.
Major capex commitment for HBM and CoWoS packaging capacity; directly addresses critical production bottleneck for Nvidia GPUs and AI chips.
Trade pressSlicast · August 5, 2026 at 07:13 UTC · US · Source: digitimes
importance 93SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands its ability to serve US customers.