AI demand has reportedly pre-booked nearly all of Samsung, SK Hynix, and Micron's planned 2027 DRAM and HBM production capacity.

A severe memory shortage may intensify in 2027 for smartphones and PCs, with SK Hynix, Samsung, and Micron having already exhausted their full 2027 DRAM and HBM capacity allocations. According to sources via SemiconductorsX, the world's three largest DRAM and HBM memory vendors have completed capacity allocation negotiations for the entire year months ahead of schedule.

AI servers and HBM are consuming nearly 70 percent of total DRAM output, leaving smartphone and PC manufacturers competing for the remaining supply. Their 2027 allocations are expected to shrink noticeably compared to current-year levels.

Samsung, SK Hynix, and Micron have sold out their entire 2027 DRAM and HBM output, while NAND Flash capacity through August 2026 is also nearing full booking. Buyers are locking in supply through advance deposits, whether or not formal long-term agreements are yet in place. Industry sources suggest most buyers are securing only 60 to 70 percent of their originally requested volumes.

Vendors are signing multi-year long-term agreements spanning three to five years with major clients. Industry insiders attribute the early capacity commitment to the chaos of 2026, which prompted manufacturers to lock in 2027 capacity well ahead of typical scheduling.

ADATA Chairman Simon Chen has publicly confirmed that the top three DRAM vendors' 2027 capacity is already sold out, with consumer electronics bearing the brunt of tighter allocations. NAND capacity from Samsung, Micron, and SanDisk for 2027 is already presold, with Kioxia and SK Hynix expected to finalize their allocations by the end of August 2026.