대만 정부는 램 리서치의 차세대 패키징 및 파브 확장 투자를 위해 NT$9.8B를 승인했다.

The Ministry of Economic Affairs announced that the Department of Investment Review approved six major investment cases yesterday. These include a NT$9.835 billion (US$310 million) investment by U.S. semiconductor equipment supplier Lam Research Corp. into its Taiwan subsidiary. According to the ministry’s statement, the approvals comprise two foreign investments in Taiwan and four outbound investments by Taiwanese companies, totaling NT$12.835 billion (US$358.36 million). Lam Research will deploy the funds into Lam Research Taiwan to support research, development, and design operations for critical equipment used in advanced semiconductor manufacturing. Separately, Cayman Islands-based Zhen Ding Technology Holding Ltd. (臻鼎科技控股) will invest NT$3 billion into its subsidiary, Boardtek Electronics Corp. (先豐通訊), to expand printed circuit board (PCB) research and development, manufacturing, and sales operations.

Among the firms approved for outbound investment is Taiwanese semiconductor manufacturer Nuvoton Technology Corp. (新唐科技), which will invest 15 billion yen (US$94.36 million) into Nuvoton Technology Corp Japan to support integrated circuit (IC) product design, development, and manufacturing. Additionally, YMA Corp. (源川國際) will allocate US$60 million to its U.S. subsidiary, YMA (TX) Inc., for the production of solid-state batteries and drone-related components. Li Yi International Investment Co. (利億國際投資), a subsidiary of Hon Hai Precision Industry Co. (鴻海精密), will invest the equivalent of US$57.01 million in Mitsubishi Fuso Bus Manufacturing Co. to bolster bus manufacturing and sales operations. Grand Health Holdings Co. (宏康控股) also completed the acquisition of Cayman Islands-based Midas Health Co. for US$147 million, indirectly securing stakes in Taiwan-based Midas Investment Co. and its subsidiary, Microlife Group (百略醫學集團). The department noted that through this acquisition, Grand Health aims to expand its professional medical equipment distribution channels and tap into the smart healthcare applications market.

In China’s hilly Guizhou Province, a cluster of European-style buildings complete with a clock tower and multi-arched bridge emits a low, permanent hum—a clear indicator of its role as tech giant Huawei’s largest data center. While the town-like complex features a unique architectural design, its location follows a broader national trend. Over the past few years, dozens of data centers have been constructed across the southwestern province as part of a government strategy to relocate digital infrastructure for rapid artificial intelligence (AI) development from China’s densely populated eastern seaboard to the less populated, rural west. This massive build-out remains ongoing.

Indian AI infrastructure firm AM Intelligence has placed an order for 9,000 Nvidia Corp. Vera Rubin systems, positioning itself as one of the first Asian adopters of the advanced computing platform. The Hyderabad-based company stated yesterday that servers equipped with these rack-scale systems will go live next year in southern India. Its customer base includes major cloud service providers, AI research laboratories, and organizations developing indigenous Indian AI models. High-end Nvidia compute cluster supplies remain constrained amid surging demand from data centers and technology giants such as Microsoft Corp., Alphabet Inc.’s Google, and Amazon.com Inc. for AI model training.

As the industry shifts focus from chip-level performance to upgrading rack-to-rack connectivity, firms are accelerating the commercialization of advanced optical technologies, according to SEMI. Silicon photonics and copackaged optics (CPO)—both viewed as essential for meeting the surging bandwidth demands of artificial intelligence (AI) infrastructure—will be central themes at Semicon Taiwan, which opens Wednesday. Event organizer SEMI announced yesterday that the exhibition, running through Friday at the Taipei Nangang Exhibition Center, is projected to set attendance records. Organizers expect over 1,300 exhibitors from 65 countries occupying 4,300 booths, alongside more than 100,000 attendees. Technical forums begin today, with optical interconnects underpinning AI infrastructure highlighted as a key focus area.

Following six years of development, chip packaging service provider Powertech Technology Inc. (力成科技) announced that its advanced fan-out panel-level packaging (FOPLP) production line has achieved a 100 percent utilization rate through 2030, well ahead of its scheduled volume production next year. Company chairman Tsai Du-kung (蔡篤恭) shared the update during the first public unveiling of the facility’s FOPLP capabilities. Expressing strong confidence in the long-term order pipeline, Powertech noted that robust market traction has eliminated concerns regarding client acquisition. “Our capacity has been fully booked by two major customers. Customers are not an issue through 2030,” Tsai told reporters at the company’s Hsinchu plant.