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Micron outlined a DRAM and NAND roadmap covering 3D NAND, High-NA EUV, new materials, and custom memory types that it expects to go mainstream as AI developers hit the limits of current memory.
A push toward custom memory at the DRAM and NAND layer suggests HBM and AI memory architectures will diversify, shifting supplier leverage and pricing power across the memory supply chain.
Trade pressSlicast · November 4, 2026 at 14:00 UTC · Global · Source: Tom's Hardware
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