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TSMC is reportedly weighing another CoWoS price hike of up to 20% as AI chip demand keeps growing.
A further price increase of up to 20% for CoWoS would raise advanced packaging costs for AI chip customers and signal that packaging capacity remains a binding bottleneck.
Trade pressSlicast · October 27, 2026 at 15:42 UTC · US · Source: TweakTown
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