Lam Research reports record Q4 FY2026 results with AI-driven semiconductor equipment demand fueling outlook. Raises guidance as AI chip packaging bottlenecks persist.

Lam Research reports record Q4 FY2026 results with AI-driven semiconductor equipment demand fueling outlook. Raises guidance as AI chip packaging bottlenecks persist.

Semip equipment makers at capacity; persistent advanced packaging constraints (CoWoS, HBM, chiplets) mean supply-limited next 12–18 months; Lam's visibility indicates sustained foundry utilization.