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Lam Research reports record Q4 FY2026 results with AI-driven semiconductor equipment demand fueling outlook. Raises guidance as AI chip packaging bottlenecks persist.
Semip equipment makers at capacity; persistent advanced packaging constraints (CoWoS, HBM, chiplets) mean supply-limited next 12–18 months; Lam's visibility indicates sustained foundry utilization.
Trade pressSlicast · July 29, 2026 at 23:22 UTC · US · Source: Investing.com
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