Qualcomm and Lumentum shares rise on accelerating demand for AI networking fabric and optical interconnect components.

Lumentum Holdings, Qualcomm, and Corning unveiled plans to demonstrate a high-density optical interconnect platform designed for next-generation AI infrastructure. The technology aims to improve data transfer between chips while reducing power consumption in large-scale AI systems.

The companies' shares gained in premarket trading—Corning up roughly 3%, Lumentum 2%, and Qualcomm 1.5%—as investors increasingly view optical networking as critical to the AI infrastructure buildout.

The demonstration will combine Qualcomm's chip-to-chip interface technology, Lumentum's VCSEL-based optical platform, and Corning's fiber connectivity products. The architecture is designed to support future AI computing systems requiring greater bandwidth and lower latency.