Home › Chips & Hardware › ReportChips & Hardware · Report"Nvidia Is Hamstrung Too": Packaging Emerges as AI Chips' New BottleneckTrade pressSlicast · July 28, 2026 at 21:05 UTC · Global · Source: economy.acimportance 82Read the originalShareCompanies in this storyNvidiaCapex history →IntelCapex history →TSMCCapex history →Related reportsChips & HardwareZ.AI to Use Only Chinese AI Chips at New Giant Data Center2026-07-29Chips & HardwareQualcomm announced Samsung expansion and new AI deals that could reshape its growth trajectory amid competition from Intel, Marvell, and Astera Labs.2026-07-29Chips & HardwareAdvanced chip packaging capacity (CoWoS) is becoming critical bottleneck as market demand doubles; pricing power shifting to packaging providers (TSMC, Intel).2026-07-29Chips & HardwareSK Hynix reports Q2 FY2026 operating profit surge of 557% year-over-year, with H1 cumulative revenue exceeding 100 trillion won for first time, driven by extraordinary DRAM and HBM demand.2026-07-29Chips & HardwareSK Hynix announces massive HBM4 production expansion in H2 2026 and signs long-term supply agreements with 10+ major industry customers to secure mid-to-long term capacity allocation.2026-07-29