Ayar Labs는 AI co-packaged optics 확대를 위해 추가로 $150 million을 모금해 2026년 펀딩 총액을 $650 million으로 끌어올렸다.

Ayar Labs has raised an additional $150 million in funding, bringing its total primary capital raised in 2026 to $650 million as the company advances its co-packaged optics technology toward high-volume manufacturing for AI infrastructure.

Cloud IT and data center infrastructure provider Wiwynn made a strategic investment earlier in 2026, joining existing strategic backers including Alchip, AMD, Intel, MediaTek, and NVIDIA. The new capital will fund product development, validation, expansion of Ayar Labs' manufacturing ecosystem, and transition to high-volume production.

The company is establishing a new Bengaluru Design Center in India to expand its engineering capacity alongside existing operations in the United States and Hsinchu, Taiwan.

Ayar Labs develops co-packaged optics—or CPO—technology for AI scale-up infrastructure. The company's optical engines move high-bandwidth connectivity closer to computing systems as AI architectures evolve from individual accelerators into larger multi-rack deployments. As these systems scale, conventional copper electrical interconnects face increasing power and physical limitations. Ayar Labs' CPO technology provides high-bandwidth, energy-efficient optical connectivity while reducing the power requirements and complexity associated with copper interconnects.

Sankara Venkateswaran, Vice President of Silicon Engineering, oversees the Bengaluru facility, which will build end-to-end engineering capabilities for silicon product development. Senior Director of Engineering Arun Balachandar serves as site lead.

Ayar Labs is rapidly hiring across all locations to commercialize and manufacture its optical technology at scale. Founded in 2015, the company is backed by venture firms and strategic semiconductor investors including AMD, Applied Ventures, MediaTek, NVIDIA, and VentureTech Alliance.

"Copper interconnect is becoming the limiting factor for AI scale-up," said Mark Wade, CEO and Co-Founder of Ayar Labs. "This funding allows us to move faster on manufacturing-ready co-packaged optics at scale. We're deepening our work across the foundry and packaging ecosystem and growing our engineering capacity to support customer programs worldwide."

"Co-packaged optics is a foundational technology for the next generation of AI and cloud data centers," said William Lin, President and CEO of Wiwynn. "Through our collaboration and investment with Ayar Labs, we see a clear path to new architectures that reduce the power and complexity limits of copper interconnects, powering rack-scale deployment for the next wave of hyperscale AI data centers."

"Our new Bengaluru Design Center supports our transition from technology development to commercialization and production," said Sankara Venkateswaran, Vice President of Silicon Engineering at Ayar Labs. "As customer demand and the complexity of our product roadmap increase, expanding our global engineering capacity will help us execute faster, support multiple development programs, and collaborate more closely with partners and customers across the region."