반도체·하드웨어 · 리포트
A report frames Broadcom's next two milestones as a 2027 Anthropic rollout and a 2028 Singapore fab.
If the 2028 Singapore fab is confirmed, it would add custom-chip manufacturing capacity outside Taiwan and tie the Anthropic rollout planned for 2027 to a multi-year manufacturing commitment.
업계 전문지Slicast · 2026년 11월 7일 13:11 UTC · 미국 · 출처: ad-hoc-news.de
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