Intel GPU chief Raja Koduri hints at a major "mother of all" Xe GPU announcement targeting data center workloads.

Intel's Raja Koduri has shared fresh details about the company's upcoming high-performance Xe GPU architecture, which he described as the "faster of all silicon." During a recent meeting with the engineering team in Bangalore, India, Koduri referred to the GPU as the "baap of all"—which translates to "the father of all"—indicating its significance as some of the largest silicon ever designed.

Koduri's comments suggest an exceptionally large GPU die. According to analyst Usman Pirzada, the specifications point toward a die size pushing 750-800mm², which would position Intel's new Xe GPU as one of the largest GPUs ever designed. Such dimensions would support expectations for strong performance, though Intel has indicated more details about the Xe architecture will be shared throughout 2020.

However, the consumer-focused Intel Xe GPU appears to be facing challenges. Recent departures of key marketing personnel—including Chris Hook and Heather Lennon, both formerly with RTG—have raised concerns about Intel's ability to effectively promote its graphics efforts. These departures underscore the need to monitor ongoing developments in Intel's GPU strategy.

It is important to note that this high-performance Xe GPU is positioned for the data center market rather than direct competition with consumer products like the GeForce RTX 2080 Ti. While Intel is unlikely to directly challenge NVIDIA or AMD in 2020, the company's competitive positioning in 2021, 2022, and beyond represents an entirely different scenario as these new architectures mature.