Global HBM memory market projected to reach $6.3 billion by 2026, driven by AI accelerator demand.

A high-performance RAM interface for TSV-based stacked DRAM memory, HMC dramatically enhances the performance of conventional memory while substantially reducing power consumption and costs. HMC can deliver 15 times higher performance compared to a DDR3 module, while consuming 70% less per bit energy. Key attributes include high per bit density and decreased form factor that enhance total memory space, with HMC devices typically requiring 90% less space than presently available RDIMMs. With these innovative performance attributes, HMC offers a resourceful platform that augments network system performance to new 100G and higher infrastructure, while keeping up with advancements in CPUs and GPUs. The use of HMC DRAM memory is currently being contemplated in applications such as graphic cards, data center infrastructure, and high-performance computing applications seeking bandwidth, form factor, and energy efficiencies.

Global Industry Analysts Inc. released its report on "Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) - Global Market Trajectory & Analytics" covering 17 companies including Advanced Micro Devices, Inc.; Arira Design; ARM Ltd.; Cadence Design Systems, Inc.; Cray, Inc.; Fujitsu Ltd.; IBM Corporation; Intel Corporation; Marvell Technology Group Ltd.; Micron Technology, Inc.; NVIDIA Corporation; Open-Silicon, Inc.; Rambus, Inc.; Samsung Electronics Co., Ltd.; SK Hynix, Inc.; and Xilinx Inc., among others. The global market for HMC and HBM, estimated at US$2.6 Billion in 2022, is projected to reach a revised size of US$6.3 Billion by 2026, registering a compounded annual growth rate (CAGR) of 25.5% over the analysis period. The United States represents the largest regional market for HMC and HBM and is projected to reach US$2.5 Billion by 2026. China is expected to spearhead growth and emerge as the fastest growing regional market with a CAGR of 31.9% over the analysis period.

The market is growing at a steady pace driven by various growth encouraging factors. Massive adoption of electronics and digital technologies in consumer, commercial, and industrial sectors on the back of widespread relevancy of "Connected World" made possible with advanced communication protocols and enabling technologies and devices is creating the persistent need for high-bandwidth, scalable, and low power consuming memory solutions. Sustained expansion in the world data center industry, on the back of steep increase in computing requirements of modern enterprises, is contributing immensely to growth and progress of HMC/HBM DRAM memory solutions. To resolve the soaring bandwidth and capacity requirements, modern data centers are increasingly relying on advanced technologies such as IoT, AI, and cloud-based services, stirring the demand for sophisticated memory solutions.

Emergence of High-Performance Computing (HPC), referring to the application of supercomputers to resolve complex computational issues, as a reliable tool for the worldwide IT industry is favoring widespread growth in the HMC and HBM marketplace. While desktop computers usually require a single processing chip generally called a CPU, the processing chip requirement for HPC is excessively high, where HMC/HBM interfaces can be handy to resolve underlying complexities. Steered by progressive developments in AI and ML, HPC gained traction in recent years and the momentum is poised to remain northbound amid increasing computational power requirements of enterprises and general consumers, indicating strong growth forecasts for HMC/HBM DRAM memory solutions. Rising adoption of artificial intelligence (AI), broadly referring to the intelligence displayed by machines contrary to the natural intelligence demonstrated by humans, across various facets of technology applications is building momentum for high-tech memory devices. AI adoption is soaring amid escalating computational capacity in the "Cloud" and improvements in sophisticated algorithms, while generating parallel opportunities for advanced hardware devices including high-performing memory and processors. Electronic device miniaturization is another major growth driver for HMC/HBM technology, as MEMS devices require advanced memory solutions made in extremely low-footprint designs with higher memory capacities, for which HMC/HBM can offer potential alternatives.