Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026

SANTA CLARA, Calif., September 20, 2026 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced industry-first 2nm optical interconnect demonstrations that advance the next generation of AI data center connectivity. The technologies will be showcased at the European Conference on Optical Communication (ECOC) 2026, September 20–24, in Málaga, Spain, underscoring how Marvell continually delivers advanced connectivity solutions to scale AI infrastructure.

As AI data center architectures scale from 1.6T to 3.2T and beyond, operators require faster, lower-power and more secure optical interconnects to serve AI scale-up, scale-out and scale-across domains. Increasing bandwidth density while reducing power per bit has become critical to scaling AI infrastructure efficiently.

Building on a multi-generational history of industry firsts—including the first 5nm 200G/lane 1.6T Marvell Nova DSPs in 2023, the 3nm 1.6T Ara platform in 2024 and the 2nm 800G Libra DSPs announced earlier this year—Marvell is extending its portfolio of 2nm connectivity solutions. These include optical PAM4, coherent-lite PAM4/IMDD and ZR/ZR+ coherent solutions, all optimized to enable ultra-high-speed interconnects that deliver faster communication between XPUs, CPUs, accelerators and memory resources while improving energy efficiency for large AI deployments.

At ECOC 2026, Marvell will highlight the following demonstrations:

**First 2nm 400G/lane optical PAM4:** Demonstrating multi-generational PAM4 leadership, this low-power, ultra-high-speed optical technology enables the transition to 3.2T data center connectivity.

**First live 2nm 800G ZR/ZR+ with MACsec:** Powered by the Marvell Libra 2nm coherent DSP, the 800G ZR/ZR+ OSFP pluggable integrates media access control security, expanding Marvell's coherent DSP and COLORZ pluggable portfolios to deliver efficient, high-performance and secure optical transmission for hyperscale AI and cloud data center networks.

**First 2nm 1.6T ZR and coherent-lite O-band demonstrations:** Powered by next-generation Marvell DSPs announced earlier this year, these demonstrations are optimized to deliver high-bandwidth connectivity within and between data center facilities, paving the way for 3.2T connectivity.

**Advanced co-packaged optics (CPO) for next-generation AI fabrics:** The Marvell CPO platform integrates optics directly with AI accelerators and switch silicon as per-lane speeds and multi-rack AI pods push past copper's reach limits. Demonstrated at 102.4 Tbps with 200G-per-lane silicon photonics, the platform delivers the bandwidth density and power efficiency needed to scale AI fabrics.

"AI data center operators need optical interconnect technologies that deliver higher bandwidth, lower power and greater security across every part of the network," said Xi Wang, senior vice president and general manager, Connectivity Business Unit at Marvell. "These ECOC demonstrations highlight how Marvell continually pushes the envelope of what is possible in optical technology to help hyperscaler and cloud data center customers achieve new levels of performance, efficiency and scalability to drive new waves of innovation."

Marvell executives will participate in presentations and panels on optical connectivity for next-generation AI data center infrastructure, including a fireside chat with Xi Wang on emerging optical technologies and sessions led by several other Marvell experts. A full lineup of speaking sessions is available online.

Beyond industry-first 2nm demonstrations, Marvell will showcase solutions across its broader AI infrastructure portfolio at ECOC (Booth #2002), from 224G SerDes and 1.6T optics to coherent interconnects and optical memory fabrics, with 38 advanced technology demos developed with its partner ecosystem.

To learn more or experience the technology demonstrations at ECOC 2026, contact your Marvell sales representative.