Home › Chips & Hardware › ReportChips & Hardware · Report三星将借道台积电3nm制程为NVIDIA下一代定制内存NVHBM制造基础芯片，HBM供应链格局重塑NewswireSlicast · October 18, 2026 at 21:04 UTC · Global · Source: The Star / Reutersimportance 83Read the originalShareCompanies in this storyNvidiaCapex history →TSMCCapex history →Related reportsChips & HardwareElon Musk called memory pricing 'extortionate' as SK Hynix maps out its strategy beyond HBM.2026-10-19Chips & HardwareKingston topped a TrendForce ranking with a 62% DRAM market share.2026-10-19Chips & HardwareBroadcom (AVGO) is facing a bottleneck as AI chip supply tightens.2026-10-19Chips & HardwareTSMC will build base dies for Nvidia's custom HBM chips.2026-10-19Chips & HardwareBroadcom (NASDAQ:AVGO) shares have fallen from $495 to $328, and a Seeking Alpha analysis argues the sell-off is a buying opportunity.2026-10-19