Memory industry reports all DRAM and HBM production capacity through 2027 fully booked; no additional capacity available for new customer allocations

According to Taiwanese outlet DigiTimes, citing "industry insiders," Samsung, SK hynix, and Micron have reportedly allocated all of 2027's DRAM and HBM capacity. In practical terms, all memory scheduled for manufacturing in 2027 by these three major suppliers is now sold out, with no additional supply planned.

The shortage is driven by the current AI boom and industry predictions that 2027 will be the worst year on record for memory supply. Demand far exceeds available capacity, prompting memory makers to sign long-term agreements with companies to supply memory for up to five years. The situation is dire.

Traditionally, July and August are when companies secure memory for the following year, making it increasingly likely that several organizations will be unable to procure the memory they need for 2027. Among big AI companies and hyperscalers purchasing vast quantities of HBM, some firms have reportedly resorted to "begging" for supply while paying significantly higher prices.

DRAM availability for PCs, laptops, and smartphones will be considerably tighter in 2027. NAND supply is similarly limited, though it may become fully booked by the end of August 2026.