Kulicke and Soffa는 시장 선도적인 Fluxless Thermo-Compression 본딩 기술을 활용해 Co-Packaged를 발전시키고 있습니다.
Singapore, September 1, 2026 – Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC), a global leader in semiconductor and electronics assembly solutions, announced that it is strengthening its role in next-generation artificial intelligence infrastructure through its advanced packaging portfolio. The company highlighted its Thermo-Compression Bonding solutions, which directly address emerging Co-Packaged Optics applications. As artificial intelligence, cloud computing, and high-performance networking scale, the semiconductor industry is adopting Co-Packaged Optics architectures to achieve greater power efficiency and bandwidth. These advancements require higher-density assembly capabilities within stacked, heterogeneous-integrated packages.
K&S has established itself as the market leader by introducing the first commercially available Fluxless Thermo-Compression solution. These systems provide unmatched flexibility, allowing customers to select integrated plasma, formic-acid, or a combination of both methods. This approach significantly improves interconnect quality, expands bandwidth capabilities, and speeds up industry adoption of heterogeneous integration. The solutions already support several advanced high-performance applications, delivering market-leading yield and throughput while giving customers a proven competitive advantage.
Artificial intelligence is fundamentally reshaping the semiconductor industry and accelerating demand for our growing base of highly capable heterogeneous solutions, said John Molnar, Vice President and General Manager, Advanced Solutions at K&S. Our advanced packaging portfolio provides the precision, performance, and capability to support the industry's most complex assembly requirements. Emerging Co-Packaged Optics applications are arguably the highest bandwidth applications and are now joining leading-edge logic and also HBM applications, as the industry rapidly migrates to next generation heterogeneous assembly.
The company's advanced packaging division is capitalizing on this rapid technological shift transforming high-performance computing, high-bandwidth memory, and advanced networking. As the sector enters a new era of artificial intelligence-driven transformation, K&S remains dedicated to providing scalable, innovative interconnect solutions that meet emerging performance and power efficiency demands. The company will showcase key features of its expanding Advanced Solutions portfolio at SEMICON Taiwan, scheduled for September 2 to September 4, 2026. Founded in 1951, Kulicke & Soffa continues to advance device performance across automotive, compute, industrial, memory, and communications markets by aligning its technology with emerging opportunities. For media inquiries, contact Marilyn Sim at Public Relations via +65-6880 9309 or [email protected]. For financial inquiries, contact Joseph Elgindy at Finance via +1-215-784-7500 or [email protected].