Gigabyte와 Schneider Electric가 AI 팩토리 인프라 협력을 발표했다고 ET Datacenters가 보도했다.

Giga Computing, a subsidiary of Gigabyte, and Schneider Electric are collaborating on an AI factory reference architecture for NVIDIA Vera Rubin NVL72. The approach connects AI compute and POD-scale management with power, liquid cooling, software, and facility infrastructure.

The collaboration aims to help operators plan and scale AI factory infrastructure more predictably, the companies said. Gigabyte contributes AI compute platforms, networking capabilities, and Gigabyte POD Manager for POD-scale operations. Schneider Electric contributes power infrastructure, liquid and hybrid cooling, data centre design, software, and facility management.

The co-engineered blueprint is designed to connect the IT and facility layers of the AI factory rather than treating each component separately. Ivy Xin, Commercial Vice President, East Asia Japan Secure Power and Data Center Business at Schneider Electric, said the next generation of AI infrastructure requires new collaboration across compute, power, and cooling. "This partnership integrates these aspects from the rack to the facility, simplifying complexity for scalable AI factories," she said.

The reference architecture uses NVIDIA Vera Rubin NVL72 as its compute foundation and organises infrastructure around repeatable scalable units. This gives operators a consistent building block for planning, deployment, and future expansion across the rack, POD, and facility layers. Andie Yen, Director of Data Center Infrastructure at Giga Computing, noted that AI infrastructure has outgrown the traditional model in which compute vendors deliver racks and facility vendors deliver everything else. "This collaboration reflects that change, bringing compute and facility aspects into the same conversation," Yen said.

High-density GPU racks create thermal loads that require cooling to be designed as part of the AI data centre architecture. Direct liquid cooling and Coolant Distribution Units (CDUs) can help transfer heat efficiently and support higher rack densities. Schneider Electric's liquid cooling portfolio addresses the thermal-management chain for high-density AI environments.

The collaboration will be showcased at Supercomputing 2026 (SC26).