BOE achieves glass-based substrate production and customer validation for advanced AI chip packaging (9-20 layer structures). Samples in testing with domestic customers.

BOE has completed its glass-based substrate production line for advanced AI chip packaging, achieving full automation in the first half of 2026 with a design capacity of 1,000 wafers per month. The company has successfully demonstrated the entire manufacturing workflow—including through-glass via (TGV) hole opening, deep copper filling, layer buildup, and routing—and developed large-format, high-layer samples (9-20 layers) in 2025 designed for advanced packaging of large-scale compute chips.

Samples are now in customer hands, with domestic clients currently in the technical testing phase following initial concept validation. The glass-based substrate targets the advanced packaging needs of AI chip makers, positioning BOE as a domestic supplier for this critical component. However, the company has not yet entered mass production or generated revenue from this product line, remaining in the validation and testing stage.

BOE's capital expenditure trajectory is expected to shift downward beginning in 2026 as the company completes its equipment buildout phase. The company has no current plans for equity offerings, suggesting it will fund operations and maintenance from existing cash position.