CXMT는 애플과의 파트너십을 사실상 확인하면서도 전 세계 최상위 고객사와의 협력 기회 탐색에 개방적임을 밝혔다.
After months of speculation regarding Apple’s potential partnership with China’s DRAM manufacturer CXMT, the situation is approaching a decisive resolution. Despite significant political friction in Washington, multiple indicators suggest a collaboration is imminent.
Apple is reportedly leveraging CXMT to strengthen its negotiating position with major memory suppliers, including Micron, Samsung, SK hynix, and Kioxia. Concurrently, the Trump administration has allegedly used the prospect of this partnership as leverage to extract concessions from the Chinese Communist Party during President Xi’s upcoming visit to the United States later this month.
Addressing rumors of a deal, CXMT issued a formal statement confirming its stance: “We take an open approach to exploring collaboration opportunities with top-tier customers worldwide. Our products are already capable of competing with leading global suppliers in terms of performance, quality, and supply reliability.” This clarification follows a nearly identical post shared by analyst Jukan (@jukan05) on September 7, 2026.
CXMT is simultaneously executing an aggressive capacity expansion. By the end of this year, the company will operate three 300mm DRAM fabrication plants, each producing approximately 100,000 wafers monthly, bringing total output to 300,000 wafers per month. Additionally, CXMT aims to achieve an HBM-focused production capacity of roughly 50,000 wafers per month by the end of 2026.
Construction is currently underway on two new fabrication facilities in Shanghai and Hefei. Once operational, these sites will elevate CXMT’s total production capacity to 600,000 wafers per month. At this trajectory, CXMT is positioned to surpass Micron in volume production by 2030.
Technologically, CXMT is rapidly advancing its capabilities. The company is already mass-producing LPDDR5X memory and has begun manufacturing LPDDR6. It also plans to initiate volume production of HBM3 later this year. To circumvent traditional process miniaturization limits, CXMT has adopted High-k Metal Gate (HKMG) technology. This approach replaces conventional silicon-based insulators with materials such as hafnium oxide (HfO₂), reducing current leakage and thermal waste while improving power efficiency. The technology enables transistors to switch states significantly faster than those using traditional polysilicon gates.
Despite these developments, Apple is expected to utilize CXMT primarily to satisfy a portion of its China-specific demand, estimated at approximately 600 million gigabytes (based on 50 million devices averaging 12GB of memory per unit). CXMT’s production schedule remains tightly constrained, with capacity fully booked through 2027 at a 95 percent utilization rate.
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