Gerchamp는 500kW부터 3.5MW까지의 모듈식 AI 데이터센터 포트폴리오를 출시했으며, 공장 조립식이고 배포 가능한

Gerchamp, a provider of modular infrastructure for AI and high-density computing based in Hangzhou, announced on September 10, 2026 that it has launched its modular AI data center portfolio. The systems bring factory-assembled power, liquid cooling, backup, and control infrastructure to sites with available power and limited space. The portfolio spans 500kW all-in-one systems to 3.5MW multi-container deployments, enabling AI compute to be deployed at the edge, on-premises, behind the meter, and in remote locations without relying on conventional data center construction.

AI workloads are increasingly moving closer to where data is generated and where power is available, making infrastructure deployment a site-level challenge. Manufacturing facilities need real-time vision inference. Telecom operators are processing increasing volumes of local traffic and video. Oil, gas, and mining operations need to run AI on operational data in locations where connectivity and data center capacity may be limited. In these environments, waiting years for a new data center is often impractical.

Gerchamp's modular architecture is designed around this shift. Its vertically integrated platform combines power, direct-to-chip liquid cooling, UPS, Nickel-Zinc battery backup, BMS, DCIM, and power distribution into factory-assembled systems that can be delivered in months and powered in weeks.

The portfolio begins with a 500kW all-in-one system that integrates the infrastructure required to support AI compute in a single container, providing IT space and power distribution for five OCP racks or four NVIDIA NVL72 racks, together with Gerchamp's proprietary direct-to-chip liquid cooling, UPS, Nickel-Zinc battery backup, BMS, and DCIM.

For larger deployments, Gerchamp combines multiple containers into a coordinated 3.5MW system. The configuration includes two IT containers, two cooling containers, and one power container, supporting 24 OCP racks or 20 NVIDIA NVL72 racks, with power density of up to 175kW per rack.

Each system is integrated and tested at the factory before shipment. Customer-selected servers and GPUs are installed separately, allowing 500kW of AI infrastructure to be brought online in weeks, while multi-megawatt deployments can be delivered in months. The modular approach also allows capacity to grow with available power. Instead of building a large facility upfront, operators can deploy infrastructure in defined power blocks and expand as additional power and compute demand become available.

Frank Yang, Chairman of Gerchamp, stated: "AI infrastructure is no longer limited to traditional data center sites. Where power is available, there is an opportunity to deploy compute. The challenge is having infrastructure that can be deployed quickly and work within the site's constraints. We are bringing power, liquid cooling, backup, and intelligent controls together in a modular platform so AI infrastructure can go where compute and power come together."

Gerchamp develops AI and high-density computing infrastructure spanning power, liquid cooling, backup power, battery management, and modular data centers. Its technologies include proprietary Nickel-Zinc battery systems, direct-to-chip liquid cooling, BMS, DCIM, and integrated power infrastructure for data centers, edge, on-premises, and other power-constrained computing environments.