Data Center Piping Market to Reach USD 4.50 Billion by 2035 as Liquid-Cooled AI Halls Push Piping Content to USD 190,000 per MW - DC Market Insights
Market grows at a 14.42% CAGR from USD 1.17 billion in 2025; liquid cooling secondary loops and rack manifolds expand 24.47% a year and North America holds 42.0% of spending
LONDON, /PRNewswire/ -- The 'Data Center Piping Market - Growth, Share, Opportunities & Competitive Analysis, 2026-2035' report has been added to the DC Market Insights offering. The global Data Center Piping Market was valued at USD 1.17 billion in 2025, is estimated at USD 1.60 billion in 2026, and is projected to reach USD 4.50 billion by 2035, growing at a CAGR of 14.42% from 2025 to 2035. DC Market Insights finds that liquid-cooled AI halls materially increase piping content per megawatt because technology cooling system loops, rack manifolds, valves and clean secondary circuits are added on top of conventional chilled-water infrastructure.
Data Center Piping Market at a Glance
Metric
Value (DC Market Insights estimate)
Market size, 2020
USD 330.00 million
Market size, 2025 (base year)
USD 1.17 billion
Market size, 2026
USD 1.60 billion (+37.12% year on year)
Market size, 2030
USD 3.36 billion
Market size, 2035
USD 4.50 billion
CAGR 2025-2035
14.42% (low case 11.00%, high case 17.50%)
Largest system
Chilled-water and condenser loops, 66.8% of 2025 value
Fastest-growing core system
Liquid cooling secondary loops and rack manifolds, 24.47% CAGR
Leading region
North America, 42.0% (USD 491.59 million)
Fastest-growing major region
Asia Pacific, 15.91% CAGR
Market concentration
Top five suppliers, about 21% of 2025 value
Key Takeaways
Liquid-cooled AI halls require about USD 190,000 of piping per new MW in 2025, compared with roughly USD 70,000 for an air-cooled chilled-water hall.
Liquid cooling secondary loops and rack manifolds rise from USD 177.12 million in 2025 to USD 1.58 billion by 2035, a 24.47% CAGR.
Chilled-water and condenser loops remain the largest system with USD 781.85 million, or 66.8% of 2025 spending.
Stainless steel grows 19.47% a year and thermoplastics 19.13% as TCS loops favor corrosion-resistant, cleaner and factory-built materials.
North America holds 42.0% of 2025 spending, while India is the fastest-growing large country at 20.70% a year.
Scope & Segmentation - Data Center Piping Market
The report analyzes the market across the following segments:
System: Chilled-Water and Condenser Loops; Liquid Cooling Secondary Loops and Rack Manifolds; Heat Rejection and Glycol Loops; Heat Reuse Export Piping
Component: Pipes; Fittings and Grooved Couplings; Valves and Actuators; Insulation and Pre-Insulated Pipe; Rack Manifolds
Material: Carbon Steel and Ductile Iron; Stainless Steel; Copper; Thermoplastics
Data Center Type: Hyperscale and AI Campuses; Colocation; Enterprise; Edge and Telecom
Geography: North America; Europe; Asia Pacific; Latin America; Middle East and Africa, with 12 country forecasts
Report Updated: Oct. 21, 2026
Get Free Sample Report - Data Center Piping Market
"Data center piping is moving from a supporting mechanical package to a direct beneficiary of the AI liquid-cooling build-out. A liquid-cooled AI hall carries about USD 190,000 of piping content per MW in 2025, nearly 2.7 times an air-cooled chilled-water hall, because a clean TCS loop and rack manifolds must reach every row. That shift makes secondary loops, stainless steel, thermoplastics and prefabricated manifolds the most attractive growth pools through 2035."
— Amit Jain, Senior Consultant, ICT & Emerging Technologies, DC Market Insights, report author
Why This Report Matters
Piping now sits at the intersection of liquid cooling, water-side reliability, heat reuse and data center construction speed. The report helps pipe, valve, fitting, insulation and manifold suppliers, engineering firms, operators, hyperscalers, colocation providers and investors size conventional chilled-water demand against rapidly expanding TCS loops, compare material choices and identify regions where AI capacity and heat-reuse rules raise piping spend per MW.
Key Attributes
Report attribute
Details
Historical Period
2020-2024
Base Year
2025
Forecast Period
2026-2035
Market Size 2025
USD 1.17 billion
Market Size 2026
USD 1.60 billion (+37.12% year on year)
Market Size 2035
USD 4.50 billion
CAGR 2025-2035
14.42% (low case 11.00%, high case 17.50%)
Leading Region
North America, 42.0% (USD 491.59 million)
Report Format
PDF + Excel
How Big Is the Data Center Piping Market in 2026?
DC Market Insights values the Data Center Piping Market at USD 1.60 billion in 2026, 37.12% above 2025. The jump reflects a sharp rise in liquid-cooled AI capacity together with higher steel pipe prices, while the longer-term forecast is driven by annual data center capacity additions, liquid-cooling penetration and retrofit demand on the installed base.
Year
Market size
2020
USD 330.00 million
2025
USD 1.17 billion
2026
USD 1.60 billion (+37.12% year on year)
2030
USD 3.36 billion
2035F
USD 4.50 billion
Source: DC Market Insights, Data Center Piping Market report, Oct. 21, 2026.
Why Does Liquid Cooling Raise Piping Spend per MW?
A conventional air-cooled chilled-water hall needs about USD 70,000 of pipe, fittings, valves and insulation per MW. A liquid-cooled AI hall adds a technology cooling system loop from the CDU toward each rack row, lifting piping content to about USD 190,000 per MW in 2025. Higher rack densities also increase demand for manifolds, clean secondary loops, isolation valves, flushing and leak-control practices, so the piping bill grows faster than floor area or IT capacity alone.
Which Piping System Leads Data Center Spending?
Chilled-water and condenser loops remain the largest system in 2025, but liquid cooling secondary loops and rack manifolds gain share fastest as direct-to-chip cooling becomes standard in new AI halls. Heat reuse export piping grows rapidly from a small base as European energy-efficiency rules create new external piping requirements.
System