반도체·하드웨어 · 리포트
A feature examines how far China's domestic advanced packaging capacity expansion has really progressed and what the supply chain still lacks.
Advanced packaging is a key bottleneck for AI accelerators, so the pace of domestic packaging buildout will shape the local supply of AI chips.
업계 전문지Slicast · 2026년 11월 8일 12:10 UTC · 중국 · 출처: 钛媒体
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