Coherent Corp. has commenced customer sampling of 300mm high thermal conductivity SiC substrates specifically engineered for AI infrastructure applications.

Coherent Corp. has commenced customer sampling of 300mm high thermal conductivity SiC substrates specifically engineered for AI infrastructure applications.

The large-scale sampling of silicon carbide substrates marks a critical milestone toward higher power density in thermal management components, directly influencing thermal design standards for AI server power modules and optical communication devices.