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Coherent Corp. has commenced customer sampling of 300mm high thermal conductivity SiC substrates specifically engineered for AI infrastructure applications.
The large-scale sampling of silicon carbide substrates marks a critical milestone toward higher power density in thermal management components, directly influencing thermal design standards for AI server power modules and optical communication devices.
Trade pressSlicast · August 18, 2026 at 18:01 UTC · Global · Source: HPCwire
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